C2160B

Description

C2160B is a Pd/Ag composition designed for hybrid applications and application where more leach resistance is required. The C2160B conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial applications where more stringent requirements exist. It exhibits excellent solderability, aged adhesion and is aluminium wire bondable.

Key Features

Excellent solderability and leach resistance Excellent long term adhesion Good AI wire bond adhesion (initial and aged)

Metal

AgPd

Viscosity

150 – 220 Kcps Brookfield HBTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C

Coverage

80 cm²/g at 12 μm fired film thickness

Coverage

80 cm²/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry condition at 5 – 25 °C,

Warranty

6 months

Printing Parameters

280 – 325 mesh stainless steel screen 0.5 mil emulsion Allow to level at room temperature for 5 – 10 minutes before drying

Printing Speed

Up to 7 in/sec

Drying Temperature

150 °C for 10 to 15 minutes_x000D_

Process Temperature (TDS)

850 °C peak temperature10 minutes at peakTotal cycle time 30 – 60 minutes

Film Thickness

Wet: 35 – 37 µm Dried: 20 – 24 µm Fired: 10 – 15 µm