C2330 is a silver/palladium (3:1) high solids conductor paste designed for hybrid applications utilizing aluminium nitride. It exhibits good solderability and excellent adhesion.
Key Features
Excellent solderability Excellent adhesion to aluminum nitride (AlN)
Metal
AgPd
Viscosity
150-220 Pa-s; Brookfield HBT, DVIII SC4-14 spindle and 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 20°C-25°C
Warranty
6 months
Printing Parameters
280 mesh stainless steel screen
Drying Temperature
150 °C peak temperature Dwell time for 10 to 15 minutes