C2360
- Paste Type: Conductor
- Substrate: Aluminum Nitride (AlN)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C2360 is a silver/palladium (6:1) high solids conductor paste designed for hybrid applications utilizing aluminum nitride. It exhibits good solderability and excellent adhesion.
Key Features
Excellent solderability
Excellent adhesion to aluminum nitride (AlN)
Excellent adhesion to aluminum nitride (AlN)
Metal
AgPd
Viscosity
150 – 220 Pa·s, Brookfield HBT DVIII, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 mesh stainless steel screen
Drying Temperature
150 °C peak temperatureDwell time for 10 to 15 minutes
Process Temperature (TDS)
850 °C peak temperatureDwell time for 10 minutes
Film Thickness
Wet: 34 – 38 µmDried: 22 – 26 µmFired: 13 – 16 µm