C4081D
- Paste Type: Conductor, Component Metallization
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Component Metallization
Details
Description
C4081D is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4081D prints and hold 5 mil lines and spaces. It's exceptional coverage makes C4081D cost effective to use.
Key Features
Excellent Ag migration resistance
High coverage
Outstanding leach resistance
High coverage
Outstanding leach resistance
Metal
AgPdPt
Viscosity
310 – 340 kcps, Brookfield HBT, spindle #6 @ 10 rpm, 25°C
Coverage
169 cm2/g at 10 microns fired film thickness
Coverage
169 cm2/g at 10 microns fired film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 stainless steel mesh
0.5 mil emulsion
0.5 mil emulsion
Drying Temperature
150°C for 10 minutes
Process Temperature (TDS)
850°C peak temperature
Dwell time of 9-11 minutes
Dwell time of 9-11 minutes
Film Thickness
Wet: 30-34 microns Fired: 7-10 microns