C4400UF
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C4400UF is an unfritted silver used primarily in multilayer applications as a top layer conductor to provide a glass free surface. C4400UF offers a highly reliable dense film which exhibits excellent solderability. C4400UF is Al wire
bondable.
bondable.
Key Features
Pure Ag Conductor overprint
Enhances solderability
Al wire bondable
Enhances solderability
Al wire bondable
Metal
Ag
Viscosity
220 – 280 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
850°C peak temperature
Dwell time of 6 to 10 minutes
Dwell time of 6 to 10 minutes
Film Thickness
10 – 14 μm