C4400UF is an unfritted silver used primarily in multilayer applications as a top layer conductor to provide a glass free surface. C4400UF offers a highly reliable dense film which exhibits excellent solderability. C4400UF is Al wire bondable.
Key Features
Pure Ag Conductor overprint Enhances solderability Al wire bondable
Metal
Ag
Viscosity
220-280 Kcps Brookfield HBT, SC4-14 spindle and 6R utility cup @ 10 rpm, 25°C.
Warranty
6 months
Process Temperature (TDS)
850°C peak temperature Dwell time of 6 to 10 minutes