C4727 (H)

Description

C4727 (H) is a 99:1 Silver/Platinum conductor, designed for low-cost applications. C4727 (H) is a fritless bonding system with excellent fired film density, high conductivity, good solder leach resistance, excellent solder acceptance and is aluminum wire bondable.

Key Features

Excellent solderability and leach resistance #Solderable on alumina and HERAEUS dielectrics
#Compatible with HERAEUS resistors #Good initial and aged adhesion, even after multiple firings #Very good conductivity
#Excellent fired film density
#Aluminum and gold wire bondable

Metal

AgPt

Viscosity

20 – 40 Pa·s, (25°C, D = 100/s)

Storage and Paste Preparation

Store in a dry and cool condition at 5 – 25°C in a dark place with container tightly shut. When stored in a refrigerator, the paste should reach room temperature before being opened.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Process Temperature (TDS)

Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes

Film Thickness

10.0 – 15.5 μm