C4774 is a silver/platinum (3:1) conductor paste designed for high leach resistant applications using aluminium nitride substrates. C4774 also has excellent adhesion and solderability.
Key Features
Excellent leach resistance Excellent solderability Excellent adhesion on aluminum nitride
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 mesh stainless steel screen 0.5 mil emulsion
Drying Temperature
150 °C for 10 minutes
Process Temperature (TDS)
850 °C peak temperature Dwell time of 10 – 15 minutes