C5007 is a wire bondable gold conductor, containing a mixed bonded Au formulation.It has been formulated to be resistant to blistering after multiple firings, also when fired together and Ag/Pd conductor Series of C2000.
Key Features
Compatible with the recrystallizable HERAEUS dielectrics IP9117 Series Excellent aged wire bond adhesion and contact resisitivity properties
Metal
Au
Viscosity
30 – 90 Pas (25 °C, D = 75/s)
Coverage
c. 50 cm2 / g (FFT: 9 µm)
Coverage
c. 50 cm2 / g (FFT: 9 µm)
Storage and Paste Preparation
Store in a dry and cool condition at 2 – 23 °C in a dark place with container tightly shut. When stored in a refrigerator, the paste should reach room temperature before being opened.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Print trough a 200 – 325 mesh screen. Level at room temperature for 10 minutes.
Printing Speed
Up to at least 10 cm / s
Drying Temperature
Dry at 150°C for 10 – 20 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes