C5729 is a gold conductor paste that has been formulated for use with Al or Au wire bond applications.
Key Features
Excellent AI and Au bondability High conductivity Fine line printing
Metal
AuAg
Viscosity
380 – 480 Kcps, Brookfield HBTSC4 – 14 spindle and 6R utility cup at 10 rpm, 25 °C
Coverage
118 cm2/g at 12 µm fired film thickness (400 mesh, 0.9 mil wire, 0.5 mil emulsion)
Coverage
118 cm2/g at 12 µm fired film thickness (400 mesh, 0.9 mil wire, 0.5 mil emulsion)
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 mesh stainless steel screen 1.2 mil wire 45° angle 0.6 mil emulsion
Printing Speed
≥ 4 in/sec (≥ 10 cm/sec)
Drying Temperature
150 ºC for 10 minutesMake sure ventilation is sufficient to prevent the wet film from skinning
Process Temperature (TDS)
850 °C peak temperature, 10 minutesat peakTotal cycle time 45 – 60 minutes