C5730 is a gold conductor paste that has been formulated for use with AI or AU wire bond applications on AI2O3 and AIN.
Key Features
Excellent AI and Au bondability High conductivity Good adhesion on AI2O3 and AIN
Metal
Au
Viscosity
280 – 380 Kcps Brookfield HBT SC4 – 14 spindle, 6R cup at 10 rpm, 25 °C
Coverage
72.0 – 75.0 cm2 /g at 22 – 25 μm wet film thickness
Coverage
72.0 – 75.0 cm2 /g at 22 – 25 μm wet film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.