C5757AS
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C5757AS is a mixed-bonded thin print gold conductor specially modified for fine line/space resolution. This formulation is designed to yield fired print thickness in the 4-8 micron range resulting in approximately twice the coverage normally exhibited by comparable performance gold conductor materials.
Key Features
Thin printing fired film
Excellent Coverage
Excellent Coverage
Metal
Au
Viscosity
575-700 kcps, Brookfield HBT,
#14 spindle in 4 oz glass jar @ 10 rpm, 25°C.
#14 spindle in 4 oz glass jar @ 10 rpm, 25°C.
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280-325 mesh stainless steel
0.3-0.5 mil emulsion
1.1 mil wire
0.3-0.5 mil emulsion
1.1 mil wire
Drying Temperature
150°C for 10-15 minutes 10 minutes.
Process Temperature (TDS)
850°C peak
Dwell time of 9-11 minutes
Dwell time of 9-11 minutes
Film Thickness
Wet 32-34 microns Dried: 10-15 microns Fired: 4-8 microns