C5909P
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C5909P is a screen printable, gold paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties. C5909P has low shrinkage, which allows for a complete fill of the through hole.
Key Features
High solids loading Low shrinkage For use in a print process
Metal
Au
Viscosity
350 – 450 kcps, Brookfield HBT, SC4 – 14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Stencil printing process
3 – 5 mil stencil thicknes
3 – 5 mil stencil thicknes
Drying Temperature
150 °C for 15 minutes
Process Temperature (TDS)
850 ºC peak temperature Dwell time 8 – 12 minutes