C8717B
- Paste Type: Conductor
- Substrate: Alumina (Al2O3), Beryllium Oxide (BeO)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C8717B is a Ag conductor that yields a smooth, dense film on alumina and BeO. This material is recommended for power hybrid applications where high current is a requirement and for large ground plane areas. C8717B provides excellent solderability, void free soldering and good solder leach resistance.
Key Features
Excellent fired film density
Low resistivity
High adhesion
Excellent solderability
Low resistivity
High adhesion
Excellent solderability
Metal
Ag
Viscosity
140 – 220 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
250 - 280 mesh stainless steel screen.
0.5 mil emulsion
0.5 mil emulsion
Drying Temperature
Leave at room temp. for 5-10 minutes.Dry at 150°C for 10 minutes.
Process Temperature (TDS)
850°C peak temperature
Dwell time of 10-12 minutes.
Total cycle time 36-60 minutes
Dwell time of 10-12 minutes.
Total cycle time 36-60 minutes
Film Thickness
Dried: 30 - 36 micronsFired: 18 - 25 microns