C8829D is a low firing silver conductive paste. It was developed for the Celcion® system and exhibits increased solder leach resistance and improved solderability.
Key Features
Low firing temperature
Increased solder leach resistance
Improved solderability
AI wire bondable
Metal
Ag
Viscosity
150 – 200 Kcps, Brookfield HBTSC4 – 14 spindle and 6R utility cup at 10 rpm, 25 °C
Process Temperature (TDS)
550 – 570 °C peak temperatureDwell time of 5 – 7 minutes