DT8785 is a solderable silver termination paste designed for NTC thermistor bodies. It has a wide firing range with excellent solderability and adhesion using lead free solder. The rheology is suitable for screen printing.
25 – 35 Pa-s; Paar Physica Rheometer, Parallel Plate (PP50), 1 mm gap, 100/s @ 25°C
Storage and Paste Preparation
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 – 325 mesh stainless steel screen 0.5 mil emulsion
Drying Temperature
150 ºC for 10 - 20 minutes
Process Temperature (TDS)
700 – 800 ºC peak temperature Dwell time of 10 – 12 minutes at peak