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DT8785
DT8785
Paste Type:
Component Metallization
Substrate:
Other Functional Ceramics
Application Method:
Screen Printing
Application:
Resistors and Fuses
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Details
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Description & Key Features
Description
DT8785 is a solderable silver termination paste designed for NTC thermistor bodies. It has a wide firing range with excellent solderability and adhesion using lead free solder. The rheology is suitable for screen printing.
Key Features
Formulated for NTC bodies Excellent adhesion Excellent solderability Wide firing window Screen printable
Paste Properties
Metal
Ag
Viscosity
25 – 35 Pa-s; Paar Physica Rheometer Parallel Plate (PP50), 1 mm gap, 100/s at 25 °C
Storage and Paste Preparation
Store in a dry location at 20 – 25 °C.
Warranty
6 months
Processing
Printing Parameters
280 – 325 mesh stainless steel screen 0.5 mil emulsion
Drying Temperature
150 ºC for 10 – 20 minutes
Process Temperature (TDS)
700 – 800 ºC peak temperature Dwell time of 10 – 12 minutes at peak
Film Thickness
Wet 32 – 34 µm Fired 10 – 12 µm