- Paste Type: Polymer Thick Film
- Application Method: Dot Dispense
- Substrate: PET / Polyimide / PC
- Metal: Ag
- Application: SMT
- Description: 2 part epoxy for SMT components on low temp substrates
- Key features: Excellent flexibility
- Printing Parameters: N/A
- Film Thickness : N/A
- Viscosity: ≈ 40Kcps
- Conductivity: <1.0 X 10-3 ?/cm
- Solids: 1
- Particle Size Distribution: <50 µ
- Resistivity (Ohm/sq.): < 1 X 10^-3 Ω-cm