EP-600
- Paste Type: Polymer Thick Film
- Substrate: PET / Polyimide / PC
- Application Method: Dispensing
- Application: Sensors, Simple Circuits
Details
Description
EP-600 two-part, silver-filled conductive epoxy is designed for component attachment, termination and other applications in hybrid circuits, membrane keypads and other electromechanical assemblies. EP-600 exhibits quick break-off after dispensing and will not cause shorts from stringing in high-speed automated production processes.
Key Features
Thixotropic properties, low viscosity & non-stringing characteristics make it ideal for high-speed dot-dispense processes which can run up to 70% faster
Exhibits outstanding adhesion to most metal & plastic substrates
Excellent temperature resistance & toughness allows for differences in coefficients of thermal expansion between bonded substrates
Lateral component push-off testing on print-treated mylar substrates show EP-600 to have 30 to 40% greater bond strength than other conductive epoxy adhesives
Convenient mix ratios and packaging are available. Options include 5-gram pre-weighed & sealed plastic CC-Packs and multiple bulk package configurations.
Metal
Ag
Viscosity
10 – 30 kcps, Brookfield DV–III Ultra, 25°C SC4-14 spindle @ SR 20, 25°C
Storage and Paste Preparation
Ambient storage, mix well prior to use.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Ensure the correct nozzle dimensions are used for the pressure of your equipment and requirements of your dot size.
Drying Temperature
100-130°C