ET1801 is a solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1801 offers excellent solderability and leach resistance.
Key Features
Suitable rheology for machine dip application
Excellent solderability and leach resistance
Compatible on titanate ceramic bodies
Metal
AgPdPt
Viscosity
30 – 40 Kcps Brookfield RVTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
Process Temperature (TDS)
780 – 810 °C peak temperature Dwell time of 5 – 6 minutes at peak