ET1803B is a solderable Ag/Pd plus 3 % Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion.ET1803B is supplied at a viscosity suitable for machine dip and blot or no blot applications
Key Features
Suitable rheology for machine dip application
Excellent solderability and leach resistance
Compatible on titanate ceramic bodies
Metal
AgPdPt
Viscosity
45 – 55 Kcps Brookfield RVT SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
Process Temperature (TDS)
780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak