ET1812A is a solderable Ag/Pt end termination designed for use on NPO MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion. ET1812A is supplied at a viscosity suitable for machine dip and blot or no blot applications
Key Features
Suitable rheology for machine dip application Excellent solderability and adhesion Compatible on NPO dielectrics
Metal
AgPt
Viscosity
35 – 45 Kcps Brookfield RVTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
780 – 810 ºC peak temperature Dwell time of 5 – 6 minutes at peak