ET1845A is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. ET1845A is supplied at a rheology suitable for machine dip application.
Key Features
Suitable rheology for machine dip application
Excellent solderabilit
Metal
Ag
Viscosity
35 – 45 Kcps, Brookfield RVT SC4 – 14 spindle and 6R cup at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 5 – 25 °C.
Warranty
6 months
Drying Temperature
150 ºC peak drying profile
10 minutes at peak temperature
20 minutes total cycle time
Process Temperature (TDS)
780 ºC peak temperature Dwell time of 4 – 6 minutes