ET1845A is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. ET1845A is supplied at a rheology suitable for machine dip application.
Key Features
Suitable rheology for machine dip application Excellent solderabilit
Metal
Ag
Viscosity
35 – 45 Kcps, Brookfield RVT SC4 – 14 spindle and 6R cup at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 ºC peak drying profile10 minutes at peak temperature20 minutes total cycle time
Process Temperature (TDS)
780 ºC peak temperature Dwell time of 4 – 6 minutes