ET1890C
- Paste Type: End Termination
- Substrate: MLCC
- Application Method: Dipping
- Application: MLCC
Details
Description
ET1890C is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre_x0002_plate processing due to the low glass content on the fired surface.The rheology of ET1890C is suitable for machine dipping.
Key Features
Nickel plateable no pre-plate processing
Low usage excellent coverage uniformity
Excellent hermeticity
ROHS1 compliant
Low usage excellent coverage uniformity
Excellent hermeticity
ROHS1 compliant
Metal
Ag
Viscosity
65 – 75 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 °C for 8 minutes20 minute total cycle time
Process Temperature (TDS)
650 – 800 °C peak temperature
Dwell time of 5 – 7 minutes at peak
Dwell time of 5 – 7 minutes at peak