ET1894 is low firing plateable silver end termination designed for application on to MLV chip components. The rheology is suitable for maching dipping applications.
Key Features
Nickel plateable Excellent fired film density and adhesion
Metal
Ag
Viscosity
35 – 45 Kcps Brookfield RVT SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 20 – 25 °C.
Warranty
6 months
Drying Temperature
150 °C for 10 minutes (20 minutes cycle using a belt dryer)
Process Temperature (TDS)
560 – 580 °C peak temperature Dwell time of 5 – 7 minutes at peak 45 minutes firing cycle