IP2109
- Paste Type: Dielectric / Glaze
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
IP2109 is a lead free, screen printable, overglaze paste for different purposes, especially for protecting thick film resistors or conductors. Because of the high firing temperature it fires to a transparent green colour and very dense glaze layer which is highly passivated to withstand abrasion and aggressive media occurring in plating processes.
Key Features
Extremely resistant vs plating solutions eg. Ni baths with pH values of 4 – 5 and H2SO4 baths with pH values < 1. It is also resistant to alkaline solutions with pH value of ≤ 9 Excellent compatibility with different HERAEUS resistors and conductors on alumina and dielectrics
Metal
None
Viscosity
20 – 40 Pa·s, (23 °C, D = 33/s)
Coverage
Coverage
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 3 months from date of manufacturing with proper storage.
Printing Parameters
Print through 200 – 325 mesh stainless steel
screen.
screen.
Printing Speed
Drying Temperature
Dry at 150 °C for 10 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness