Expansion coefficient is closely matched with that of alumina, to provide for minimal substrate bowing Extremely dense, hermetic fired film allows for excellent electrical performance in a 2 layer, large area build-up Excellent solderability and adhesion of Ag, Ag/Pd, Ag/Pt, Au and Au/Pt conductors on top of dielectric Excellent wire bondability of Ag and Au based conductors on top of dielectric Resistors can be processed on top of dielectric Absence of the “Battery Effect” in more than 12 refinings3 A separation of dissimilar conductor metallizations such as gold and silver is possible without formation of blisters. This enables the use of more cost-effective, high-conductivity pure silver conductors underneath the dielectric Compatible with high reliability laser trimming methods