- Heraeus Electronics /
- Products and Solutions /
- Thick Film Materials /
- Product Selector /
- LPA92-59
LPA92-59
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
LPA92-59 is a screen printable gold conductor paste, designed to metallize punched or laser drilled through-holes in alumina substrates.
Key Features
LPA92-59 contains a glass-filler, for good adhesion on to the inside wall of holes (through-holes) The viscosity has also been adjusted, for good vacuum through-hole printing It also works well as via-fills in multilayer dielectric, for interconnecting conductor layers
Metal
Au
Viscosity
30 – 50 Pa·s (25°C, D = 75/s)
Storage and Paste Preparation
Store in a dry, cool (2 - 23°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Print through a 200 – 325 mesh stainless
steel screen.
Level at room temperature for 10 minutes.
steel screen.
Level at room temperature for 10 minutes.
Printing Speed
Up to at least 10 cm/s
Drying Temperature
Dry at 150 °C for 10 - 20 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and
with a total firing cycle time of c. 30 – 60
minutes.
with a total firing cycle time of c. 30 – 60
minutes.