PC10136

Description

PC10136 is a frit bonded gold conductor designed for printing onto a variety of ceramic substrates including NTC thermistors, PZT and alumina.

Key Features

Formulated for a variety of substrates Frit bonded material Screen printable

Metal

Au

Viscosity

190 – 240 kcps Brookfield HBT Spindle #SC4-14 and 6R utility cup at 10 rpm, 25 °C_x000D_

Coverage

70 – 75 cm2 /g at 50 µm wet film thickness

Coverage

70 – 75 cm2 /g at 50 µm wet film thickness

Storage and Paste Preparation

Store in a dry location at 5 – 25 °C

Warranty

6 months

Printing Parameters

200 – 325 mesh stainless steel screen 0.5 mil emulsion thickness Allow parts to level at room temperature for 10 – 15 minutes before drying, but parts should be dried as soon as possible after levelling to prevent skinning, which can compromise adhesion. Wet parts should be covered if not dried right away.

Printing Speed

Up to 25 cm/sec (10 in/sec)

Drying Temperature

150 ºC for 10 minutes Make sure ventilation is sufficient to prevent the wet film from skinning

Process Temperature (TDS)

750 – 850 ºC peak temperature Dwell time of 5 – 10 minutes at peak

Film Thickness

11 – 13 µm