PC10136
- Paste Type: Component Metallization
- Substrate: PZT, NTC Ceramics, Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Piezo, Component Metallization
Details
Description
PC10136 is a frit bonded gold conductor designed
for printing onto a variety of ceramic substrates
including NTC thermistors, PZT and alumina.
for printing onto a variety of ceramic substrates
including NTC thermistors, PZT and alumina.
Key Features
Formulated for a variety of substrates
Frit bonded material
Screen printable
Frit bonded material
Screen printable
Metal
Au
Viscosity
190 – 240 kcps, Brookfield HBT SC4-14 spindle & 6R utility cup @ 10 rpm , 25°C
Coverage
70 – 75 cm2
/g at 50 µm wet film thickness
/g at 50 µm wet film thickness
Coverage
70 – 75 cm2
/g at 50 µm wet film thickness
/g at 50 µm wet film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200 – 325 mesh stainless steel screen
0.5 mil emulsion thickness
Allow parts to level at room temperature for 10 – 15
minutes before drying, but parts should be dried as soon
as possible after levelling to prevent skinning, which can
compromise adhesion. Wet parts should be covered if not
dried right away.
0.5 mil emulsion thickness
Allow parts to level at room temperature for 10 – 15
minutes before drying, but parts should be dried as soon
as possible after levelling to prevent skinning, which can
compromise adhesion. Wet parts should be covered if not
dried right away.
Printing Speed
Up to 25 cm/sec (10 in/sec)
Drying Temperature
150 ºC for 10 minutesMake sure ventilation is sufficient to prevent the wet film from skinning
Process Temperature (TDS)
750 – 850 ºC peak temperature
Dwell time of 5 – 10 minutes at peak
Dwell time of 5 – 10 minutes at peak
Film Thickness
11 – 13 µm