PC10899

Description

PC10899 is a low temperature firing silver paste designed to screen print solderable electrodes onto a variety of electrical ceramic component devices. The fired film forms a highly adherent bond to many types of substrates, including piezo-electric transducers (PZTs), NTC thermistors, alumina, steatite, and porcelain. The metalized electrode is readily solderable for external lead attachment.

Key Features

RoHS compliant* REACH compliant** Lower firing temperature (< 700°C) Screen printable Excellent solderability Designed for piezo-electric transducers (PZTs), NTC thermistors, alumina, steatite, and porcelain

Metal

Ag

Viscosity

80-100 Kcps Brookfield HBT SC-14 spindle and 6R utility cup at 10 rpm, 20°C

Storage and Paste Preparation

Store in a dry location at 5 – 25 °C

Warranty

6 months

Printing Parameters

60-250 mesh stainless steel screen 0.7 -1.0 mil emulsion Allow parts to level at room temperature for 10 minutes before drying.

Drying Temperature

100-150°C for 10-15 minutes.

Process Temperature (TDS)

650-700°C peak firing temperature Dwell time of 8-12 minutes at peak Total cycle time of 45-60 minutes. Larger parts may require a longer firing profile.

Film Thickness

9 - 15 microns