PC10904 is a high performance silver conductor designed for metallizing ceramic component devices. The rheology of PC10904 is optimized for dipping and spraying methods of application.
Key Features
Excellent conductivity High adhesion to various oxide substrates Optimized for dipping and spraying applications
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
The material should be thoroughly shaken before use. Apply the material by dipping or spraying.
Drying Temperature
125-150°C for 5-10 minutes.
Process Temperature (TDS)
850°C - 925°C peak temperature Dwell time of 5-10minutes dwell time.