PC10904HG is a high performance silver conductor designed for metallizing ceramic component devices. The rheology of PC10904HG is optimized for dipping and spraying methods of application. PC10904HG is a higher green strength version of PC10904.
Key Features
High green strength Excellent conductivity High adhesion to various oxide substrates Optimized for dipping and spraying applications
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
The material should be thoroughly shaken before use. Apply the material by dipping or spraying.
Drying Temperature
125-150°C for 5-10 minutes.
Process Temperature (TDS)
850°C - 925°C peak temperature Dwell time of 5-10minutes dwell time.