TC7304A is a pure Ag via fill which provides excellent compatibility with Heraeus tape system of CT700 and CT800 during the co-firing process.
Key Features
Optimized for stencil printing of vias Compatible with other co-firing pastes and with various post firing pastes After firing, the paste can easily be soldered.
Metal
Ag
Viscosity
200 – 300 Pas (25 °C, D = 15/s)
Process Temperature (TDS)
Fire at 850-865 °C (peak) for up to 30 minutes, and with a total firing cycle time up to 10 hours (most often practicable in a box oven).