TC7406
- Paste Type: LTCC
- Substrate: LTCC
- Application Method: Screen Printing
- Application: LTCC
Details
Description
TC7406 is a silver palladium via fill conductor (ratio Ag:Pd= 13:1) which provides excellent compatibility with Heraeus tape system of CT700 and CT800 Series during the co-firing process.
Key Features
Optimized for stencil printing of vias Recommended as a via-fill paste for top vias for connection to Au pastes TC7104 and C5756 Also compatible with Ag and AgPt co-firing pastes, TC7303 (LPA410-053) and TC7601 (LPA610-066), and with various post-firing pastes
Metal
AgPd
Viscosity
150 – 250 Pa·s (25°C, D = 15/s)
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 12 months from date of manufacturing with proper storage.
Process Temperature (TDS)
Fire at 850 – 865 °C (peak) for up to 30 minutes, and with a total firing cycle time up to 10 hours (most often practicable in a box oven)