TC7406

Description

TC7406 is a silver palladium via fill conductor (ratio Ag:Pd= 13:1) which provides excellent compatibility with Heraeus tape system of CT700 and CT800 Series during the co-firing process.

Key Features

Optimized for stencil printing of vias Recommended as a via-fill paste for top vias for connection to Au pastes TC7104 and C5756 Also compatible with Ag and AgPt co-firing pastes, TC7303 (LPA410-053) and TC7601 (LPA610-066), and with various post-firing pastes

Metal

AgPd

Viscosity

150 – 250 Pas (25 °C, D = 15/s)

Process Temperature (TDS)

Fire at 850 – 865 °C (peak) for up to 30 minutes, and with a total firing cycle time up to 10 hours (most often practicable in a box oven)