- Paste Type: Polymer Thick Film
- Application Method: Dot Dispense
- Substrate: PET / Polyimide / PC
- Metal: N/A
- Description: Glob top encpsulant for improved component adhesion
- Printing Parameters: N/A
- Film Thickness : N/A
- Solids: 1
- Particle Size Distribution: <5 µ
- Resistivity (Ohm/sq.): N/A
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