As the demand for Silicon-Carbide (SiC) devices increases in the automotive and industrial sectors, traditional power module packaging technologies struggle to meet reliability requirements due to higher temperatures and power densities.
Learn how Heraeus Electronics addresses these challenges with its mAgic® paste variants, PE360P and PE360D, large area sinter pastes designed for module attach applications. The paper, first published in Power Electronic News, highlights their excellent joint properties and remarkable reliability during thermal cycling tests, essential for enhancing power electronics designs.
