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  4. Direct Copper Bonded (DCB) Aluminiumoxid (Al2O3) Substrate

DCB Substrates: Proven Reliability for Power Electronics

  • Condura®.extra

    ►Enhanced mechanical robustness through zirconia-toughened alumina ceramic

    ►Cost-effective performance upgrade over standard alumina substrates

    ►Bending strength ≥ 600 N/mm²

  • Condura®.classic

    ►Industry-standard alumina DCB substrate with proven reliability

    ►Excellent cost-efficiency ratio for high-volume applications

    ►Broad range of copper and ceramic thickness configurations

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Reliable Supply You Can Build On

Condura® DCB substrates are produced at our manufacturing site in Romania, providing you with a reliable, European supply chain. Combined with tailored raw material sourcing, we ensure consistent quality and supply continuity giving you the confidence to plan your production with a trusted European partner.

Condura®.extra - Zirconia-toughened Alumina (zta) DCB

Condura®.extra uses zirconia-toughened alumina (ZTA) to deliver enhanced mechanical robustness compared to standard alumina substrates - while maintaining the cost advantages and manufacturing maturity of DCB technology. It’s the ideal choice when your application needs more than standard alumina can offer, but doesn’t require the full performance of silicon nitride.

The ZTA ceramic (ZrO₂: 9–14%) is available in thicknesses of 0.25 mm and 0.32 mm, with direct copper bonding Cu-OFE in thicknesses of 0.20, 0.25, 0.30, 0.40 mm. Delivery as single unit or mastercard (usable area 178 × 127 mm). Surface finish options include bare Cu, Ni, Ni/Au, full or selective Ag plating.

Material Properties

Property Rating Unit
Bending Strength ≥ 600 N/mm²
Thermal Conductivity (@20 ºC) ≥ 22 W/m·K
Coefficient of thermal expansion (100-600 ºC) 7 ppm/K
Young´s modulus (@20 ºC) ≥ 300 GPa
Density ≥ 3.95 g/cm³
Electrical resistivity ≥ 10¹⁴ Ω·cm
Dielectric strength ≥ 20 kV/mm

 

Download Condura®.extra Design Guidelines

Condura®.classic - Alumina DCB

Condura®.classic is the foundation of the Condura® portfolio - an alumina-based DCB substrate that delivers reliable performance at an excellent cost-efficiency ratio. Built on industry-standard Al₂O₃ ceramic (96%) and proven direct copper bonding technology, Condura®.classic is the smart choice for applications where consistent quality and competitive pricing are the primary requirements.

Available with alumina ceramic in thicknesses of 0.38 mm and 0.63 mm, and copper in thicknesses from 0.20 mm to 0.40 mm. This broader range of configurations provides maximum design flexibility. Delivery as single unit or mastercard (max. usable area 178 mm × 127 mm). Surface finish options include bare Cu, Ni, Ni/Au, full or selective Ag plating.

Material Properties

Property Rating Unit
Bending strength ≥ 450 N/mm²
Thermal conductivity (@ 20 °C) ≥ 20 W/m·K
Coefficient of thermal expansion (100–600 °C) 6.7 – 8.7 ppm/K
Young’s modulus (@ 20 °C) ≥ 300 GPa
Density ≥ 3.73 g/cm³
Electrical resistivity ≥ 10¹³ Ω·cm
Dielectric strength ≥ 15 kV/mm

Download Condura®.classic Design Guidelines