mAgic® Sinter Pastes for High Performance Applications
mAgic® Sinter Pastes for High Performance Applications
Higher power densities come along with a higher operation temperature. At the same time, devices must last longer. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times.
Silver sintering technology is suited for high operation temperatures due to its pure Ag die attach layer. They also provide excellent thermal conductivity and at the same time a longer lifetime compared to solder.
The Heraeus Electronics mAgic® series sinter material is suitable for power applications on substrates, baseplates or heatsinks (pressure sintering) as well as for lead frame packages (non-pressure sintering).
The special series for die attach pressure sintering mAgic® PE338 (formerly ASP338) show an increased lifetime up to 10 times more compared to conventional solder in power cycling. As well, it requires low process pressure compared to other sintering materials. For module attach applications the new mAgic® PE360 enables the maximum performance from the system.
For non-pressure sintering applications, sinter mAgic® DA295 (formerly ASP295) series is a lead-free substitute for high melting point solders. The products are available for usage in semiconductor applications. These come as print or dispense version and offer high thermal conductivity for lead frame and LED packages.
Use our experience to find the best solution for your die attach application.
Benefits:
- Up to 10 times higher lifetime compared to solder paste
- Applicable from extremely low to high temperature range (-55 to 250°C) due to the solid silver layer
- Pure Ag interconnect for operation temperatures up to 250°C
- Enables increasing of power density (system cost reduction) at a total costs level comparable to solder process
- Typical thermal conductivity of 150 W/mK and above
- Zero-halogen formulation
- Less process steps due to no flux cleaning, no splattering
- Designed for use in automatic processing with industrial equipment
- Wide process window:
- stencil life time >8h
- both pressure and non pressure sintering available
- variable process temperatures of 200 – 250°C
Pressure Sinter Pastes
| Product | Material Application | Workable Surfaces | Application Size | Sintering Temperature & Pressure | Description |
|---|---|---|---|---|---|
| mAgic® PE338 | Printing / Jetting | Au, Ag, Cu | Up to 15x15mm² | >230°C, in Air or N2 >10MPa or 30MPa (Cu) |
Suitable for SiC, GaN or IGBT die attach on ceramic substrate |
| mAgic® PE360 | Printing / Dispensing | Au, Ag, Cu | Larger than 15x15mm² | >200°C, in Air or N2 >10MPa |
Suitable for substrate or power module attach on baseplates or heatsinks |
Non-Pressure Sinter Pastes
| Product | Material Application | Workable Surfaces | Sintering Temperature | Sintering Atmosphere | Comment |
|---|---|---|---|---|---|
| mAgic DA295 A | Dispensing | Au, Ag | >200 °C | Air, N2 | Needle diameter > 0.2mm Positive results on die size <4mm2 Optimized for ENIG PCB surfaces |
