Microbond® - Solder Preforms 
For Power Module Attach

Microbond® Solder Preforms are engineered to meet the mechanical, thermal, and reliability requirements of modern power module assembly. Designed for secure attachment of power packages to baseplates or coolers, they utilize advanced Innolot alloys to ensure consistent performance — even under harsh thermal cycling and high-power conditions. Their clean and easy process without paste printing simplifies production, reduces material waste to a minimum, and supports high-throughput manufacturing.

With flexible sizing and form factors, Microbond® Solder Preforms are compatible with the majority of module and substrate interconnect applications in the market. As a balanced solution between cost and performance, they offer durable and efficient bonding for a wide range of power electronics assemblies.

Microbond® Innolot Solder Preforms are a proven solution for power module interconnection like preform module attach and substrate attach applications requiring long-term reliability. The Innolot solder alloy composition is optimized for mechanical strength and thermal stability, ensuring secure attachment of modules to baseplates or coolers—even under extreme thermal cycling.

The alloy’s low melting point minimizes warpage and protects sensitive components and internal interconnections, making it ideal for demanding molded module attach environments in automotive and industrial power electronics.

For applications balancing performance and cost, Microbond® Innolot 2.0 Solder Preforms offer an advanced solution. This alloy maintains the performance benefits of traditional Innolot alloy while using a lower precious metal content to reduce overall material costs.

With a melting temperature only slightly higher than standard Innolot, Innolot 2.0 is well-suited for power module interconnections in molded modules or frames modules with multiple substrates. It supports a balanced approach to thermal performance, mechanical strength, and cost-efficiency.

• Trusted performance in the module attach and solder market
• Precision manufacturing for consistent quality
• Compatibility with molded interconnect substrates
• Designed for engineers seeking reliable, scalable solutions
• First class technical support and expertise to solve your packaging and assembly challenges

Whether you're looking to attach metal substrate to baseplate or bond modules to coolers, Microbond® preforms offer a clean, flux-free solution with lead free solder material that supports high-throughput manufacturing and high design flexibility.

Ready to improve your power electronics production process with high-performance solder preforms? Contact us to speak with our experts and request a sample or technical consultation.