3571UF

Description

3571UF is an unfritted silver paste used primarily in multilayer applications as a top layer conductor to provide a glass free surface. 3571UF offers a dense fired film that exhibits excellent solderability.

Key Features

Pure Ag Conductor overprint
Enhances solderability
Excellent fired film density

Metal

Ag

Viscosity

180 – 240 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

70-75 cm2/gm at 50 micron wet film thickness

Coverage

70-75 cm2/gm at 50 micron wet film thickness

Storage and Paste Preparation

Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

200-325 stainless steel mesh screen
0.5 mil emulsion
Allow parts to level at room temperature for 5-10 minutes.

Printing Speed

Up to 10 in/sec (25 cm/sec)

Drying Temperature

150°C for 10 to 15 minutes

Process Temperature (TDS)

850- 925°C peak temperature
Dwell time of 5-10 minutes at peak

Film Thickness

9 - 15 μm