3610 is a gold conductor paste designed for microcircuit applications requiring aluminum wire bonds. 3610 is comprised of a mixed bond frit system that offers excellent aged wire bond adhesion for aluminum and gold wires. 3610 fires to a dense, pin-hole free film.
Key Features
Excellent Al and Au wire bondability Dense fired film
50-60 cm 2/gm (Calculated from 50 micron wet film)
Coverage
50-60 cm 2/gm (Calculated from 50 micron wet film)
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
325 stainless steel mesh screens 0.3-0.5 mil emulsion Allow parts to level at room temperature for 1-3 minutes before drying.
Printing Speed
Up to 15 cm/sec (6 in/sec)
Drying Temperature
150°C for 5-10 minutes.
Process Temperature (TDS)
850°C to 950°C peak temperature Dwell time of 5-10 minutes at peak