3610

Description

3610 is a gold conductor paste designed for microcircuit applications requiring aluminum wire bonds. 3610 is comprised of a mixed bond frit system that offers excellent aged wire bond adhesion for aluminum and gold wires. 3610 fires to a dense, pin-hole free film.

Key Features

Excellent Al and Au wire bondability
Dense fired film

Metal

Au

Viscosity

190 – 220 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

50-60 cm 2/gm
(Calculated from 50 micron wet film)

Coverage

50-60 cm 2/gm
(Calculated from 50 micron wet film)

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

325 stainless steel mesh screens
0.3-0.5 mil emulsion
Allow parts to level at room temperature for 1-3 minutes
before drying.

Printing Speed

Up to 15 cm/sec (6 in/sec)

Drying Temperature

150°C for 5-10 minutes.

Process Temperature (TDS)

850°C to 950°C peak temperature
Dwell time of 5-10 minutes at peak

Film Thickness

Fired 8-14 microns