- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Glass
- Metal: Ag
- Application: Hybrid IC
- Description: AB1 is a low temperature firing silver conductor paste. AB1 was designed for use on glass. The rheology has been formulated for screen printing.
- Key features: Low firing temperature
Good solderability
Low resistivity
- Printing Parameters: 165 – 280 mesh stainless steel screen0.5 mil emulsion
- Process Temperature: 510 – 540 °C peak temperature
Dwell time of 3 – 4 minutes
- Film Thickness : Wet: 34 – 38 µm
Dried: 22 – 26 µm
Fired: 16 – 20 µm_x000D_
- Viscosity: 60 – 80 Kcps Brookfield HBTSC4 – 14 spindle, 6R utility cup at10 rpm, 25°C
- Conductivity: ≤ 8 milliohms/square at 12 um fired film thickness
- Solids: 83.5 ± 1.0 %
- Alloy Ratio: 100
- Resistivity (Ohm/sq.): ≤ 8 mΩ/ at 12 μm fired film thickness