- Paste Type: Polymer Thick Film
- Application Method: Screen Print
- Substrate: PET / Polyimide / PC
- Metal: Ag
- Application: Seed layer for plating
- Description: Heat stable to 175-200°C
- Printing Parameters: Polyester Mesh (157 to 230 TPI)
Steel Mesh (165 to 325 TPI)
- Film Thickness : 12-25 µm DFT
- Viscosity: 10 - 15 Kcps
- Conductivity: <.040 Ω/sq/mil
- Solids: 68% ± 2%
- Particle Size Distribution: <25 µ
- Resistivity (Ohm/sq.): <.040 Ω/square