C1076SD (LPA609-022) is a low-cost Ag/Pt conductormaterial that utilizes an oxide bond system for providing particularly excellent adhesion to alumina and beryllium oxide substrates. The material can easily be used to print fine line patterns or large-area ground planes and features all the advantages of a fritless system. Resulting film is dense and uniform.
Key Features
Excellent solderability and leach resistance
Solderable on alumina
Compatible with HERAEUS resistors
Excellent initial and aged adhesion Inner layer for multilayer applications
Very good conductivity
Aluminum and gold wire bondable
Metal
AgPt
Viscosity
30 – 50 Pas (25 °C, D = 100/s)
Coverage
80 cm2/g (FFT: 12 μm)
Coverage
80 cm2/g (FFT: 12 μm)
Storage and Paste Preparation
Store in a dry and cool condition at 2 – 23 °C in a dark place with container tightly shut, When stored in a refrigerator, the paste should have acquired room temperature before being opened
Warranty
6 months
Printing Parameters
Print through a 200 – 325 mesh stainless steel screen. Total thickness: 50 – 110 μm
Printing Speed
Up to 20 cm/s
Drying Temperature
Dry at 150 °C for 10 – 20 minutes
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes