C2129A

Description

C2129A is a high performance mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion. C2129A is also aluminum wire bondable. C2129A is supplied with a rheology, which results in a dense, uniform fired film.

Key Features

Low cost
Excellent solderability and leach resistance
Low resistivity
Good Al wire bond adhesion (initial and aged)

Metal

AgPd

Viscosity

120 – 180 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

85 cm²/g at 12 μm fired film thickness

Coverage

85 cm²/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 – 325 mesh stainless steel screen
0.5 mil emulsion
1.1 mil wire

Drying Temperature

150 °C for 10 minutes

Process Temperature (TDS)

850 °C peak temperature Dwell time at peak temperature for 10 minutes

Film Thickness

Wet: 30 – 36 µmDried: 22 – 27 µmFired: 10 – 15 µm