- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina (Al2O3)
- Metal: AgPd
- Application: Hybrid IC
- Description: C2130 is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminium wire bondable.
- Key features: Excellent solderability and leach resistance
Excellent long term adhesion
Good AI wire bond adhesion (initial and aged)
- Printing Parameters: 280 – 325 mesh stainless steel screen
0.5 mil emulsion
Allow to level at room temperature for 5 – 10 minutes before
drying
Printing Sp
- Process Temperature: 850 °C peak temperature10 minutes at peakTotal cycle time 30 – 60 minutes
- Film Thickness : 10 – 15 μm
- Viscosity: 150 – 220 Kcps Brookfield HBT
SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 35 milliohms/square at 12 um fired film thickness
- Solids: 79.0 ± 1.0 %
- Alloy Ratio: 3 : 1
- Resistivity (Ohm/sq.): ≤ 35 mΩ/ at 12 μm fired film thickness