C2130

Description

C2130 is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminium wire bondable.

Key Features

Excellent solderability and leach resistance Excellent long term adhesion Good AI wire bond adhesion (initial and aged)

Metal

AgPd

Viscosity

150 – 220 Kcps Brookfield HBT SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C

Coverage

75 cm²/g at 12 μm fired film thickness

Coverage

75 cm²/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry condition at 5 – 25 °C,

Warranty

6 months

Printing Parameters

280 – 325 mesh stainless steel screen 0.5 mil emulsion Allow to level at room temperature for 5 – 10 minutes before drying Printing Sp

Printing Speed

Up to 7 in/sec

Drying Temperature

150 °C for 10 to 15 minutes_x000D_

Process Temperature (TDS)

850 °C peak temperature10 minutes at peakTotal cycle time 30 – 60 minutes

Film Thickness

10 – 15 μm