C4082

Description

C4082 is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4082 prints and holds 5 mil lines and spaces.

Key Features

Excellent Ag migration resistance
High coverage
Outstanding leach resistance

Metal

AgPdPt

Viscosity

150 – 250 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

80 – 90 cm2/g at 30 – 35 μm wet film thickness

Coverage

80 – 90 cm2/g at 30 – 35 μm wet film thickness

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 stainless steel mesh
0.5 mil emulsion

Drying Temperature

150°C for 10 minutes

Process Temperature (TDS)

850 °C peak temperatureDwell time of 9 – 11 minutes

Film Thickness

Wet: 30-35 microns Dried: 18-21 microns Fired: 10-15 microns