C4082 is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4082 prints and holds 5 mil lines and spaces.
Key Features
Excellent Ag migration resistance High coverage Outstanding leach resistance
Metal
AgPdPt
Viscosity
150 – 250 Kcps, Brookfield HBTSpindle #14 utility cup at 10 rpm, 25 °C
Coverage
80 – 90 cm2/g at 30 – 35 μm wet film thickness
Coverage
80 – 90 cm2/g at 30 – 35 μm wet film thickness
Storage and Paste Preparation
Store in a dry location at 5°C-25°C
Warranty
6 months
Printing Parameters
280 stainless steel mesh 0.5 mil emulsion
Drying Temperature
150°C for 10 minutes
Process Temperature (TDS)
850 °C peak temperatureDwell time of 9 – 11 minutes