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- C4727 (H)
C4727 (H)
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C4727 (H) is a 99:1 Silver/Platinum conductor, designed for low-cost applications. C4727 (H) is a fritless bonding system with excellent fired film density, high conductivity, good solder leach resistance, excellent solder acceptance and is aluminum wire bondable.
Key Features
Excellent solderability and leach resistance #Solderable on alumina and HERAEUS dielectrics
#Compatible with HERAEUS resistors #Good initial and aged adhesion, even after multiple firings #Very good conductivity
#Excellent fired film density
#Aluminum and gold wire bondable
#Compatible with HERAEUS resistors #Good initial and aged adhesion, even after multiple firings #Very good conductivity
#Excellent fired film density
#Aluminum and gold wire bondable
Metal
AgPt
Viscosity
20 – 40 Pa·s, (25°C, D = 100/s)
Storage and Paste Preparation
Store in a dry and cool condition at 5 – 25°C in a dark place with container tightly shut. When stored in a refrigerator, the paste should reach room temperature before being opened.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness
10.0 – 15.5 μm