C4774 is a silver/platinum (3:1) conductor paste designed for high leach resistant applications using aluminium nitride substrates. C4774 also has excellent adhesion and solderability.
Key Features
Excellent leach resistance Excellent solderability Excellent adhesion on aluminum nitride
Metal
AgPt
Viscosity
150 - 220Kcps; Brookfield HBT, SC4-14 spindle and 6R utility cup at 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 20 °C – 25 °C
Warranty
6 months
Printing Parameters
280 mesh stainless steel screen 0.5 mil emulsion
Drying Temperature
150 °C for 10 minutes
Process Temperature (TDS)
850 °C peak temperature Dwell time of 10 – 15 minutes