C4774

Description

C4774 is a silver/platinum (3:1) conductor paste designed for high leach resistant applications using aluminium nitride substrates. C4774 also has excellent adhesion and solderability.

Key Features

Excellent leach resistance
Excellent solderability
Excellent adhesion on aluminum nitride

Metal

AgPt

Viscosity

150 – 220 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 mesh stainless steel screen
0.5 mil emulsion

Drying Temperature

150 °C for 10 minutes

Process Temperature (TDS)

850 °C peak temperature
Dwell time of 10 – 15 minutes

Film Thickness

Dried 32 – 36 µmFired 10 – 14 µm