C5020

Description

C5020 is an unfritted lead, gold conductor. It is designed for application on top of a gold-based layer to increase thickness and solderability.In a single print and fire application on a gold base layer it yields a thick, dense film that is free from blisters, cracks, and other cosmetic defects.C5020 has good adhesion when printed over a gold base layer of Heraeus Au conductors. It is not designed to be used without a gold base layer.

Key Features

Excellent choice for higher conductivity applications that require thick gold conductor

Metal

Au

Viscosity

35 – 55 Pa·s (25°C, D = 75/s)

Coverage

Approx. 50 cm2
/ g (FFT: 8 µm)

Coverage

Approx. 50 cm2
/ g (FFT: 8 µm)

Storage and Paste Preparation

Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

Print through a 200 – 325 mesh stainless steel screen.
Level at room temperature for 10 minutes.

Printing Speed

Up to at least 10 cm / s

Drying Temperature

Dry at 125 - 150 °C for 10 - 20 minutes.

Process Temperature (TDS)

Fire at 550 – 950 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes

Film Thickness

6 – 10 μm