C5729

Description

C5729 is a gold conductor paste that has been formulated for use with Al or Au wire bond applications.

Key Features

Excellent AI and Au bondability High conductivity Fine line printing

Metal

AuAg

Viscosity

380 – 480 Kcps, Brookfield HBTSC4 – 14 spindle and 6R utility cup at 10 rpm, 25 °C

Coverage

118 cm2/g at 12 µm fired film thickness
(400 mesh, 0.9 mil wire, 0.5 mil emulsion)

Coverage

118 cm2/g at 12 µm fired film thickness
(400 mesh, 0.9 mil wire, 0.5 mil emulsion)

Storage and Paste Preparation

Store in a dry location at 5°C-25°C

Warranty

6 months

Printing Parameters

280 mesh stainless steel screen
1.2 mil wire
45° angle
0.6 mil emulsion

Printing Speed

≥ 4 in/sec (≥ 10 cm/sec)

Drying Temperature

150 ºC for 10 minutes
Make sure ventilation is sufficient to prevent the wet
film from skinning

Process Temperature (TDS)

850 °C peak temperature, 10 minutesat peakTotal cycle time 45 – 60 minutes

Film Thickness

Dried: 20 – 22 µm
Fired: 8 – 11 µm