C5789 gold conductor paste is designed for use both onalumina and in multilayer applications. C5789 exhibitsexcellent gold and aluminum wire bondability (1 mil)without bond misses. C5789 is especially suitable for fineline applications.
Key Features
Excellent wire bendability#Compatibility with Heraeus air fireable resistors#Prints 6 mils lines and spaces
Metal
Au
Viscosity
450-550 Kcps, Brookfield HBT14 spindle at 10 rpm, 25 °C
Process Temperature (TDS)
850 ºC peak temperature. Dwell time of 9-11 minutes.